Chiphow Microelectronics
Chiphow Microelectronics(Huizhou)Co., Ltd formerly known as China Aerospace International Holdings Co., Ltd., is a research and development center established in 2020. The company's registered capital is 90 million yuan. It belongs to China Aerospace International Holdings Co., Ltd. (00031. HK) wholly-owned subsidiary, a third-level subsidiary of a central enterprise; the company is committed to providing domestic and foreign customers with high-quality IPM, IGBT and other power module packaging sub-masing business.
The company focuses on IPM and PM sealing and testing sub-construction, with a registered capital of RMB 90 million and an investment of RMB 198 million in the first phase. It now has the monthly production standard IPM modules DIP29 200K, DIP25 600K, SDIP26 600K, SDIP26FP The sealing and testing capacity of 300K, SDIP25FP 300K, and Easy PIM 100K. The company has international first-class production equipment, reliability testing and inspection equipment, advanced process capabilities, perfect quality management system and senior technical team. It has the full-process closed-loop research and development production capabilities from chip matching, module design, process simulation, packaging production to final test application, which can provide customers with Customized module solutions. The company is committed to becoming the world's leading semiconductor intelligent power module sealing and testing sub-manpower enterprise, and wholeheartedly providing high-quality services for domestic and foreign users.
The company focuses on IPM and PM sealing and testing sub-construction, with a registered capital of RMB 90 million and an investment of RMB 198 million in the first phase. It now has the monthly production standard IPM modules DIP29 200K, DIP25 600K, SDIP26 600K, SDIP26FP The sealing and testing capacity of 300K, SDIP25FP 300K, and Easy PIM 100K. The company has international first-class production equipment, reliability testing and inspection equipment, advanced process capabilities, perfect quality management system and senior technical team. It has the full-process closed-loop research and development production capabilities from chip matching, module design, process simulation, packaging production to final test application, which can provide customers with Customized module solutions. The company is committed to becoming the world's leading semiconductor intelligent power module sealing and testing sub-manpower enterprise, and wholeheartedly providing high-quality services for domestic and foreign users.
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0Founded
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0+ m²Factory Area
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0+Elite Team
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0.1KKMonthly Capacity
Corporate Culture
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Corporate vision
Become the world's leading power semiconductor module packaging subcommansor!Corporate vision
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Corporate mission
Create customer value and increase shareholder benefits. Achieve the future of employees and create a better life.Corporate mission
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Core values
Science and technology lead development, and quality creates the future.Core values
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Enterprise spirit
Work hard, seek truth from facts, have the courage to innovate, and be willing to contribute.Enterprise spirit
Development History
Organizational Structure

Honors & Qualifications







