Chiphow Microelectronics Corporation
Huizhou Guanghui Microelectronics Co., Ltd., Formerly Known As China Aerospace International Holdings Limited, Is A Research And Development Center Established In 2020. The Registered Capital Of The Company Is 90 Million Yuan. It Belongs To China Aerospace International Holdings Limited (00031). HK) Wholly-owned Subsidiary, A Third Tier Subsidiary Of A Central Enterprise; The Company Is Committed To Providing High-quality IPM, IGBT, And Other Power Component Packaging Boards For Domestic And Foreign Customers.The Company Focuses On Closed Testing Civil Engineering For IPM And PM, With A Registered Capital Of RMB 90 Million And A First Phase Investment Of RMB 198 Million. At Present, We Have Monthly Standard IPM Module DIP29 200K, DIP25 600K, SDIP26 600K, SDIP26FP Sealing Test Capabilities Of 300K, SDIP25FP 300K, And Easy PIM 100K. The Company Has World-class Production Equipment, Reliability Testing And Inspection Equipment, Advanced Process Capabilities, A Sound Quality Management System, And A Senior Technical Team. It Has The Full Process Closed-loop R&D Capability From Chip Matching, Module Design, Process Simulation, Packaging Production To Final Testing And Application, And Can Provide Customized Module Solutions For Customers. The Company Is Committed To Becoming A Globally Leading Semiconductor Intelligent Power Component Packaging And Testing Sub Human Resources Enterprise, Wholeheartedly Providing High-quality Services To Domestic And Foreign Users.
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0Founded
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0+ m²Factory Area
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0+Elite Team
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0.6KKMonthly Capacity
Corporate Culture
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Corporate Vision
Become A World Leading Power Semiconductor Module Packaging And Outsourcing Enterprise!Corporate Vision
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Corporate Mission
Create Customer Value And Increase Shareholder Benefits. Achieve Employees' Future And Create A Better Life.Corporate Mission
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Quality Policy, Environmental Policy
Quality Policy, Environmental Policy
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Corporate Spirit And Mission
Strive Hard, Seek Truth From Facts, Be Brave In Innovation, And Be Willing To Contribute.Corporate Spirit And Mission
Development History
April 2020
IPM Packaging R&D Center Established (Kanghui Semiconductor) Aerospace Holdings Established The IPM Packaging R&D Center In Response To The National Industrial Policy Of Developing New Power Electronic Devices, Green Energy Conservation And Environmental Protection, And Supporting The Strategic Background Of Import Substitution;
May 2021
In January, The First DIP29 Was ProducedIn May, DIP29 Passed The Reliability Test And Successfully Went Into Mass ProductionIn December, DIP25 Research And Development Project Was Initiated
May 2022
In Order To Promote The High-quality Development Of Aerospace International Holdings, Fill The Product Gap In The Field Of Aerospace Holdings' System Integration, Optimize Product And Industrial Structure Adjustment, And Expand Research Results, The IPM Packaging R&D Center Has Been Spun Off From Its Original Unit To Establish Zhihao Microelectronics;
Two Thousand And Twenty-three
In February, DIP25 Successfully Went Into Mass Production
June 2023
The New Factory Building Has Completed Its Topping OutWith Strong Support From Aerospace Holdings, The New Factory Completed Its Topping Out In June. The New Factory Has A Construction Area Of 16000 Square Meters And Can Accommodate The Layout Of 20 IPM Production Lines;
January 2024
Launch The Second Phase Of Expansion Project, Adding 700K Of Production Capacity Per MonthThis Expansion And Relocation Marks A Qualitative Leap In Production Capacity For Zhihao Microelectronics, Which Will Strongly Support The Company's Future Market Layout And Strategic Planning;
August 2024
Complete The Relocation Of The New Factory BuildingThis Relocation Has Optimized The Production Layout, Enhanced Overall Competitiveness, And Will Strongly Support The Company's Future Market Layout And Strategic Planning;
Organizational Structure
Honors & Qualifications
