Product OEMThe company is committed to becoming a world-leading semiconductor intelligent power module packaging and testing outsourcing enterprise.
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Standard Packaging Product Manufacturing
The company specializes in IPM, PM packaging and testing outsourcing, with a registered capital of 90 million RMB and an initial investment of 1.98 billion RMB. It now has the packaging and testing outsourcing capacity for standard IPM modules DIP29 200K, DIP25 600K, SDIP26 600K, SDIP26FP 300K, SDIP25FP 300K, and Easy PIM 100K per month.
