Product OEMThe Company Is Committed To Becoming A Leading Global Semiconductor Intelligent Power Module Packaging And Testing Outsourcing Enterprise.
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Manufacturing Of Standard Packaged Products
The Company Specializes In IPM, PM Packaging, And Testing Outsourcing, With A Registered Capital Of 90 Million Yuan And An Initial Investment Of 1.98 Billion Yuan. Now, It Has The Ability To Package And Test Standard IPM Modules DIP29 200K, DIP25 600K, SDIP26 600K, SDI 26FP 300K, SDI 25FP 300K, And Easy PIM 100K On A Monthly Basis.
