PIM new product introduction

In April 2023, Zhihao Microelectronics (Huizhou) Co., Ltd. launched a new package form factor PIM, which is compatible with imported products and supports pluggable replacement. The product uses a nickel-plated DBC substrate, which ensures heat dissipation while providing good oxidation resistance.

Module outline

The internal circuit topology of this module includes rectification, braking, and three-phase inverter functions. The first sample is 120V40A, and the PIN position, internal circuit topology, and current/voltage specifications can be adjusted according to customer needs.

Circuit topology

The production process uses solder paste printing combined with vacuum reflow soldering to ensure product void rates and soldering strength.

Module welding rendering

Corporate mission

Creating greater value for customers

Creating a better life for humanity

Enhancing benefits for shareholders

Seeking development for employees

Corporate Vision

To become a world-leading power module packaging foundry enterprise

Core values

Technology leads development, quality shapes the future