Easy 2 B module-Chiphow Microelectronics (Huizhou) Co., Ltd | IPM Power Module Packaging & Testing Services | IGBT Module Assembly and Test Manufacturer | Intelligent Power Module Outsourcing Solutions

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Easy2B features flexible circuit layout characteristics, diverse circuit topologies, and uses a highly insulated, thermally conductive DBC as the power device carrier substrate; DBC surface nickel plating treatment prevents oxidation of the DBC copper layer; This module is mainly used in medium to high-power variable frequency conversion fields, such as photovoltaics, servers, frequency converters, air conditioners, and more.