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DIP 25 intelligent power module
- The DIP25 package type uses DBC, which is highly insulating and conducts heat efficiently, as the power device substrate; A highly reliable copper frame serves as the carrier substrate for the driver IC; The corresponding electrical pins are routed through a copper frame, and optional power-side temperature detection pins enable more precise module temperature detection. The compact packaging structure makes it very easy to use, especially suitable for applications requiring compact installation.
25pod尺寸图
