DIP 29 intelligent power module-Chiphow Microelectronics (Huizhou) Co., Ltd | IPM Power Module Packaging & Testing Services | IGBT Module Assembly and Test Manufacturer | Intelligent Power Module Outsourcing Solutions

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The DIP29 package type uses DBC, which is highly insulating and thermally conductive, as the power device carrier substrate; High-reliability, highly flexible PCBs serve as the driver IC carrier substrate; By extending the corresponding electrical pins through a copper frame, it provides a very compact package, making it very convenient to use and especially suitable for applications requiring compact installation.